UNIVERSALBARRIER® Thin-Film Encapsulation

We have developed a novel, thin-film encapsulation technology for the ultra-flexible plastic substrate systems.

• Effective permeation barrier with hybrid organic-inorganic properties
• Transparent and flexible film properties
• Effective perimeter coverage for nearly edgeless or ‘bezel-less’ packaging
• Enables ultra-flex barrier without cracking down to < 1 mm bend radius
• Cost-effective process and compatible with roll-to-roll processing
• Well suited for OLED, PV, battery and other thin-film devices