UNIVERSALBARRIER® Thin-Film Encapsulation
We have developed a novel, thin-film encapsulation technology for the ultra-flexible plastic substrate systems.
- Effective permeation barrier with hybrid organic-inorganic properties
- Transparent and flexible film properties
- Effective perimeter coverage for nearly edgeless or ‘bezel-less’ packaging
- Enables ultra-flex barrier without cracking down to < 1 mm bend radius
- Cost-effective process and compatible with roll-to-roll processing
- Well suited for OLED, PV, battery and other thin-film devices
